SICK is one of the world’s leading solutions providers for sensor-based applications in the industrial sector. Founded in 1946 by Dr.-Ing. e. h. Erwin Sick and headquartered in Waldkirch im Breisgau near Freiburg, the company is a technology and market leader with 63 subsidiaries and affiliates as well as numerous agencies around the globe. SICK has more than 10,000 employees worldwide and generated a group revenue of EUR 1.8 billion in the 2025 fiscal year.
Job Description
Mandatory Internship / Thesis: Optimization and Transformation of CAD Models in 3D ToF Sensors
 

Winter semester 2026/27 – fixed term of 3–6 months

 

YOUR TASKS:

  • Familiarize yourself with the 3D configuration workflow of 3D ToF sensors and develop a concept for importing CAD data
  • Integrate an import interface for CAD data
  • Reduce the complexity of CAD models for further processing
  • Optimize outer model surfaces and transform them into depth maps
  • Implement a rule-based verification routine based on deterministic geometry analyses
  • Extend the verification process with an LLM-based validation approach considering relevant standards and regulations

 

YOUR PROFILE:

  • Enrolled in Computer Science, Information Technology, Electrical Engineering, or a comparable field of study
  • Knowledge of C++ or a comparable programming language
  • Strong technical interest in high-resolution 3D vision sensor technology
  • Good command of English
  • Empathetic personality with enthusiasm for working in interdisciplinary teams
  • Systematic, solution-oriented, and independent working style with a strong quality focus
  • Creativity and enthusiasm for innovation in problem-solving
Information at a Glance
Apply now
Requisition-ID:  37833
Posting Job Location:  Waldkirch (near Freiburg)
Full-time/Part-time:  Full-time

Contact: Sarah Disch

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At SICK, we see people, not gender. 
We put great emphasis on diversity, reject discrimination and do not think in categories such as gender, ethnicity, religion, disability, age or sexual identity.